IEC’s Sold-Out Broadband World Forum Europe Exhibition to Spotlight Cutting-Edge Innovations Next Month in Berlin
More than 110 vendors from around the world will arrive in Berlin to exhibit the latest information and communication technologies (ICT) advancements at the International Engineering Consortium’s (IEC) Broadband World Forum Europe 2007
CHICAGO – September 21, 2007 – With an exhibition floor that has been sold out since the beginning of the year, the International Engineering Consortium again expects to host a rich marketplace of broadband opportunities with the Broadband World Forum Europe this 8-11 October at the Estrel Convention Center. The leading-edge exhibition will feature some of the industry’s top products, services and applications from Official Host Sponsor Deutsche Telekom AG and 110 leading vendors.
“Last year’s Broadband World Forum Europe hosted 60 different service providers and we expect an even greater level of carrier participation on the exhibition floor this year in Berlin,” commented IEC President John Janowiak. “The level of attention the Broadband World Forum Europe has drawn illustrates the rich broadband business opportunities available that delegates can expect.”
Provided with an ideal opportunity to discuss new advancements and technologies with key industry organizations, visitors on the floor will witness the latest developments teaching them how to keep implementation costs down and maximize return on infrastructure investment.
The Broadband World Forum Europe 2007 exhibition will also present some of the InfoVision Award winners –products judged as the most successfully deployed broadband products, services and applications.
Industry professionals can also expect the most recent developments from major sponsors of the show such as Official Host Sponsor Deutsche Telekom AG, Alcatel-Lucent, Ericsson, Nokia Siemens Networks, ECI, Huawei Technologies, NEC Australia, Thomson, ZTE, KEYMILE, Motorola, Accenture, ADVA Optical Networking, AVM, Freescale Semiconductor, PacketFront, Schmid Telecom, Tellabs, ACCESS, ADC KRONE, Nagravision, Kudelski Group, Rittal, Texas Instruments, Redback Networks, Operax and more.
Attendees will have the opportunity to view 12 TecPreviews from ADVA Optical, Alcatel-Lucent, Bridgewater Systems, Huawei Technologies, Iskratel, KEYMILE, Motorola, Nokia Siemens Networks, PeerApp, Schmid Telecom and Telcordia that will provide them with an in-depth look and key insight into the fundamentals, trends and developments of new technology areas.
Attendees can preview Hot Technologies of exhibiting companies at
www.iec.org/events/2007/bbwf/exhibition/hot_technologies.html The International Engineering Consortium invites all industry professionals to register at
www.iec.org/events/2007/bbwf/register/ All accredited members of the media are entitled to complimentary access. Register at
www.iec.org/events/2007/bbwf/press/press_reg.html For complete information, visit
www.iec.org/events/2007/bbwf or contact Lisa Reyes at
[email protected] or at +1-312-559-3325.
