|
Title: IBM cools new chips with water Post by: Shrey on June 05, 2008, 07:20:06 PM IBM cools new chips with water
3D chip structure that integrates hair-thin water pipes will provide a solution for heat management in high-processing computers, says IBM. http://www.news.com/8301-17912_3-9960566-72.html?part=rss&subj=news&tag=2547-1_3-0-20 |